System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Opportunity Score
Why this score?
Opportunity
50 / 100
Complexity
60 / 100
Risk factors
No budget or estimated value disclosed; risk of mismatch between buyer's expectation and bidder's pricing.
Requirement for 'at least 3 comparable projects not older than three years' may be restrictive for newer entrants.
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Overview
Moderate opportunityKey Facts
- Supplies contract
- 1 lot
- Duration 23 MONTH
- Supply and delivery of a high aspect ratio etch system (mainframe and process chambers)
- Tool must be fully automated for 300mm wafer processing
Show full summary
Supply of a fully automated plasma etch system for high aspect ratio features on 300mm wafers, to be delivered to Fraunhofer in Dresden, Germany. The tender uses a negotiated procedure without prior publication (neg-w-call) and is partially funded by EU funds. The contract duration is 23 months. No estimated value is provided. Submission deadline: 15 July 2026, 11:30 (CET).
Risks
No budget or estimated value disclosed; risk of mismatch between buyer's expectation and bidder's pricing.
Requirement for 'at least 3 comparable projects not older than three years' may be restrictive for newer entrants.
Analysis may be incomplete
Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.
Key Requirements
Technical
- Technical product/service features (55% weight)
- Binding delivery period (10% weight)
- Price (35% weight)
Award Criteria
Lot 1
Buyer
Name
Fraunhofer-Gesellschaft - Einkauf B12
Location
München, DEU
Website
Buyer profile
Identifier
DE 129515865
Lots (1)
LOT-0000
System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
1 piece of a fully automated plasma etch tool for 300mm wafers, cleanroom class 1000 (ISO Class 6) environment. Purpose: patterning of high aspect ratio features in silicon and related materials (SiO2, SiN). Optional items per technical specification.
Location
Duration
Category
Selection criteria
Deadline
Award details
Show original TED data
Original TED description
1 Piece: System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) A fully automated process tool to be used for plasma etch processes on wafers with a diameter of 300 mm. The systems will be used for the processing of Silicon CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. The new tool shall be used for patterning of high aspect ratio features in silicon as well as all related needed materials (e.g. SiO2, SiN) to reach this main target. Optional items according to Technical Tender Specification.
Procurement Details
- Publication date
- 10 Jun 2026
- Notice type
- Contract notice — standard
- Languages
- German, English
Reference metadata
- Notice subtype
- 16
- Notice version
- 1
- Legal basis
- 32014L0024
Reference IDs
- Tender ID
- 399697-2026
- Source notice ID
- e136cb0f-1988-4bde-aada-4ab40d6d273b
Documents (2)
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Opportunity Score
Why this score?
Opportunity
50 / 100
Complexity
60 / 100
Risk factors
No budget or estimated value disclosed; risk of mismatch between buyer's expectation and bidder's pricing.
Requirement for 'at least 3 comparable projects not older than three years' may be restrictive for newer entrants.
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications