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The Supply, Delivery and Validation of a Digital Microscope System for Tyndall National Institute, University College Cork

University College Cork·Cork, Ireland·EUR 65.5k·Deadline Jul 07, 2026 · 13 days left·Open·Supplies
Structured notice only
70/100

Opportunity Score

PromisingMedium complexity
SuppliesOpen
Why this score?

Opportunity

70 / 100

Complexity

40 / 100

Risk factors

Key details such as selection and award criteria are not included in the tender notice, and procurement documents have...

The structured data lists four lots, but only the first has substantive details (identifier, title, value, deadline). T...

Submission deadline in 13 days

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Deep Company Fit Analysis

Uses:

  • Description
  • Industries & Services
  • Capabilities
  • Market & Experience
  • Certifications

Overview

Strong opportunity

Key Facts

  • EUR 65.5k estimated value
  • Supplies contract
  • 1 lot
  • Supply and delivery of a digital microscope system
  • System must provide high-resolution imaging, 2D/3D measurement, surface profiling, focus stacking, image stitching, tilted observation, automated repetition of setup conditions
Show full summary

Open tender by University College Cork for a digital microscope system (supplies) with integrated hardware/software for high-resolution imaging and measurement of electronic/microelectronic structures. Single lot, estimated value €65,450 EUR, deadline 2026-07-07. Electronic submission required, language English. Place of performance: Cork, Ireland (IE053). No selection or award criteria provided in the available notice; procurement documents not analyzed.

Risks

Key details such as selection and award criteria are not included in the tender notice, and procurement documents have...

The structured data lists four lots, but only the first has substantive details (identifier, title, value, deadline). T...

Submission deadline in 13 days

Analysis may be incomplete

Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.

Key Requirements

Technical

  • System must be a fully integrated bench-top solution with embedded computing
  • Capabilities: high-resolution imaging, 2D/3D measurement, surface profiling, focus stacking, image stitching, tilted observation, automated repetition of setup conditions

Certifications

  • All software licenses for measurement, characterization, image acquisition, analysis, and data export must be included

Requirements may be incomplete.

Buyer

Name

University College Cork

Location

Cork, IRL

Website

www.ucc.ie

Buyer profile

Open profile

Identifier

IE0006286E

Lots (4)

LOT-0001

The Supply, Delivery and Validation of a Digital Microscope System for Tyndall National Institute, University College Cork

Supply, delivery and validation of a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. System must include high-resolution imaging, 2D/3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions. Fully integrated bench-top solution with embedded computing and all required software licenses.

SuppliesElectronic submission

EUR 65.5k

Estimated value

Location

Ireland

Category

Microscopes

Deadline

Deadline Jul 07, 2026

Lot 2

Lot 2

Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.

Category

Metallurgical microscopes

Lot 3

Lot 3

Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.

Category

Stereo or dissecting light microscopes

Lot 4

Lot 4

Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.

Category

Inverted and metallurgical microscopes

Procurement Details

Publication date
15 Jun 2026
Notice type
Contract notice — standard
Languages
English

Reference metadata

Notice subtype
16
Notice version
1
Legal basis
32014L0024

Reference IDs

Tender ID
412329-2026

Documents (2)

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