The Supply, Delivery and Validation of a Digital Microscope System for Tyndall National Institute, University College Cork
Opportunity Score
Why this score?
Opportunity
70 / 100
Complexity
40 / 100
Risk factors
Key details such as selection and award criteria are not included in the tender notice, and procurement documents have...
The structured data lists four lots, but only the first has substantive details (identifier, title, value, deadline). T...
Submission deadline in 13 days
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Overview
Strong opportunityKey Facts
- EUR 65.5k estimated value
- Supplies contract
- 1 lot
- Supply and delivery of a digital microscope system
- System must provide high-resolution imaging, 2D/3D measurement, surface profiling, focus stacking, image stitching, tilted observation, automated repetition of setup conditions
Show full summary
Open tender by University College Cork for a digital microscope system (supplies) with integrated hardware/software for high-resolution imaging and measurement of electronic/microelectronic structures. Single lot, estimated value €65,450 EUR, deadline 2026-07-07. Electronic submission required, language English. Place of performance: Cork, Ireland (IE053). No selection or award criteria provided in the available notice; procurement documents not analyzed.
Risks
Key details such as selection and award criteria are not included in the tender notice, and procurement documents have...
The structured data lists four lots, but only the first has substantive details (identifier, title, value, deadline). T...
Submission deadline in 13 days
Analysis may be incomplete
Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.
Key Requirements
Technical
- System must be a fully integrated bench-top solution with embedded computing
- Capabilities: high-resolution imaging, 2D/3D measurement, surface profiling, focus stacking, image stitching, tilted observation, automated repetition of setup conditions
Certifications
- All software licenses for measurement, characterization, image acquisition, analysis, and data export must be included
Requirements may be incomplete.
Buyer
Name
University College Cork
Location
Cork, IRL
Website
Buyer profile
Identifier
IE0006286E
Lots (4)
LOT-0001
The Supply, Delivery and Validation of a Digital Microscope System for Tyndall National Institute, University College Cork
Supply, delivery and validation of a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. System must include high-resolution imaging, 2D/3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions. Fully integrated bench-top solution with embedded computing and all required software licenses.
EUR 65.5k
Estimated value
Location
Category
Deadline
Award details
Additional CPV codes
Value note
Show original TED data
Original TED description
Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.
Lot 2
Lot 2
Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.
Category
Lot 3
Lot 3
Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.
Category
Lot 4
Lot 4
Tenders are required to provide a digital microscope system for advanced inspection, characterization, imaging, and dimensional analysis of electronic and microelectronic structures. The system will be used for high-resolution observation and measurement of multilayer PCB structures, integrated circuit dies, semiconductor devices, 3D-printed electronic components, interconnects, solder joints, micro-vias, and related laboratory samples. The proposed system must provide integrated hardware and software capabilities for high-resolution imaging, 2D and 3D measurement, surface profiling, focus stacking, image stitching, tilted observation, and automated repetition of setup conditions such as image capturing and 2D/3D surface characterization. The system must operate as a fully integrated bench-top solution, including embedded computing and all software licenses required for measurement, characterization, image acquisition, analysis, and data export.
Category
Procurement Details
- Publication date
- 15 Jun 2026
- Notice type
- Contract notice — standard
- Languages
- English
Reference metadata
- Notice subtype
- 16
- Notice version
- 1
- Legal basis
- 32014L0024
Reference IDs
- Tender ID
- 412329-2026
Documents (2)
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Opportunity Score
Why this score?
Opportunity
70 / 100
Complexity
40 / 100
Risk factors
Key details such as selection and award criteria are not included in the tender notice, and procurement documents have...
The structured data lists four lots, but only the first has substantive details (identifier, title, value, deadline). T...
Submission deadline in 13 days
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications