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Kauf einer DRIE/ RIE-Anlage (Plasmaätzanlage)

Westsächsische Hochschule Zwickau·Zwickau, Germany·Deadline Jul 03, 2026 · 9 days left·Open·Supplies
Structured notice only
50/100

Opportunity Score

Needs reviewHigh complexity
SuppliesOpen
Why this score?

Opportunity

50 / 100

Complexity

85 / 100

Risk factors

No estimated contract value or budget is provided, making it difficult to assess bid viability and competition level.

Very detailed and stringent technical specifications (etch rates, profile, endpoint detection, software standards) may...

Submission deadline in 9 days

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Overview

Moderate opportunity

Key Facts

  • Supplies contract
  • 1 lot
  • Duration 50 WEEK
  • Supply of a DRIE/RIE plasma etching system for 100mm and 150mm wafers
  • Bosch process capability with silicon removal rate up to 2.5 mm³/s
Show full summary

Open tender by Westsächsische Hochschule Zwickau for a DRIE/RIE plasma etching system (including substrate electrode, edge protection, notching control, endpoint detection, software, installation, and training). Delivery to Zwickau, Germany, within 50 weeks. The tender appears to be for a single lot despite structured data showing three lots (likely a data extraction issue). Award criteria: 30% price, 60% fulfillment of performance parameters, 10% delivery time. Selection criteria require an application lab within 12 hours travel from Zwickau. No estimated value disclosed. Submission deadline 2026-07-10, electronic submission only, German language. Procurement documents not analyzed.

Risks

No estimated contract value or budget is provided, making it difficult to assess bid viability and competition level.

Very detailed and stringent technical specifications (etch rates, profile, endpoint detection, software standards) may...

Submission deadline in 9 days

Analysis may be incomplete

Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.

Key Requirements

Technical

  • System must process 100mm and 150mm wafers (with/without flat, notch)
  • Silicon etch rate ≥10 µm/min in acceptance test
  • Sidewall deviation ≤10 µm from tangent

Requirements may be incomplete.

Award Criteria

Lot 1

Preiskriterium30%

Buyer

Name

Westsächsische Hochschule Zwickau

Location

Zwickau, DEU

Website

www.whz.de

Buyer profile

Open profile

Identifier

14-1215011WHZ01-34

Lots (1)

LOT-0001

Kauf einer DRIE/ RIE-Anlage (Plasmaätzanlage)

Supply of a DRIE/RIE system for silicon deep etching and RIE of thin dielectrics, including all components (process chamber, ICP source, gas lines, pumps, etc.), electrostatic chuck, edge protection, notching control, endpoint detection (optical emission), software with SEMI E95 compliance, installation, and training. Acceptance test with specific etch rate and profile requirements. Delivery to Zwickau, max 50 weeks after order.

SuppliesEU fundedElectronic submission

Location

Zwickau, Germany

Duration

50 WEEK

Category

Laboratory, optical and precision equipments

Selection criteria

Price

Deadline

Deadline Jul 10, 2026

Procurement Details

Publication date
04 Jun 2026
Notice type
Contract notice — standard
Languages
German

Reference metadata

Notice subtype
16
Notice version
1
Legal basis
32014L0024

Reference IDs

Tender ID
388383-2026
Source notice ID
2ccf26c1-6b0a-47ce-8228-ad9b97611ff8

Documents (2)

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